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NCS5000 Integrated RF Schottky Detector
The NCS5000 is an integrated schottky detector intended for use as a level detector in RF measurement/power control applications such as those found in GSM handsets. The detector converts the peak RF voltage applied to a DC level. The circuit consists of an RF schottky detector, a reference schottky diode, as well as biasing and control circuitry. There is an enable input that allows the part to be placed in a low power state when not in use. The detector is designed for operation up to 2.0 GHz and can operate with input power levels up to +25 dBm. There is a fixed offset of 10 mV (nominal) between the Reference Detector and the RF Detector under no applied RF. The two detectors are monolithically integrated so that they closely track over temperature, voltage and process. The NCS5000 is housed in a very small TSOP-6 package ideal for portable applications. The TSOP-6 package is a lower profile, footprint compatible package to the SOT23-6.
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6 1 TSOP-6 SN SUFFIX CASE 318G
PIN CONNECTIONS AND MARKING DIAGRAM
DET_OUT VCC Enable 1 BAFyw 2 3 (Top View) BAF = Specific Device Code yw = Date Code 6 5 4 REF GND RF_In
* * * * * * * * * * *
Wide Operating Frequency Range to 2.0 GHz 2.7-5.5 V Operating Voltage Very Low Operating Current of 300 mA Enable Control to Place the Part in a Low Current Standby Mode Typical Standby Current of < 1.0 mA -40 to 85C Operating Temperature Range Very Small TSOP-6 Package Cellular Handsets (GSM and DCS1800/PCS1900) Wireless Data Modems Transmitter Power Measurement and Control Test Equipment
Typical Applications
ORDERING INFORMATION
Device NCS5000SNT1 Package TSOP-6 Shipping 3000/Tape & Reel
VCC
Enable RF_In
Compensated Current Sources
DET_OUT REF
GND This circuit has 28 active transistors
Figure 1.
(c) Semiconductor Components Industries, LLC, 2001
1
September, 2001 - Rev. 2
Publication Order Number: NCS5000/D
NCS5000
PIN DESCRIPTION
Pin 1 2 3 4 5 6 Name DET_OUT VCC Enable RF_In GND REF Description This is the RF Detector Output. This signal is proportional to the peak RF voltage applied at the RF_In pin. Input power supply. Control signal to turn on and off the device. If this signal is not used, this pin should be connected directly to VCC. A logic high on this input turns on the device. This is the input to the RF detector. The signal must be AC-coupled into this input with a good quality RF capacitor. Ground. This is the reference detector output. Nominal this signal is 10 mV higher than DET_OUT when no RF signal is applied at RF_In.
MAXIMUM RATINGS (TA = 25C, unless otherwise noted.)
Rating Maximum Input Power on RF Pin Maximum Power Supply Symbol PMAX Value 28 Unit dBm V V
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VCCMAX - 6.0 ESD Rating for RF_In (HBM) All Other Pins are 2.5 kV (HBM) Storage Temperature Range 500 Tstg TJ -40 to +125 +150 C C - - Maximum Junction Temperature Maximum Input Voltage on Pins Minimum Input Voltage on Pins VIMAX VIMIN VCC + 0.3 V -0.3 V
RECOMMENDED OPERATING CONDITIONS
Characteristic RF Input (50 W Equivalent) Supply Voltage Operating Temperature Range
Symbol RFin VCC TA
Min - 2.7 -40
Typ - - -
Max 25 5.5 85
Unit
dBm V C
ELECTRICAL CHARACTERISTICS
(VCC = 2.8 V, for typical values; TA = 25C, for min and max values; TA= -40 to 85C unless otherwise noted.) Characteristic RF Operating Frequency Operating Current Consumption (Venable = 2.4 V, No RF Applied) Standby Current Consumption (Venable = 0.4 V, No RF Applied) Power Supply Ripple Rejection (VCC = 3.6 V, Vripple = 0.5 VPP, No RF) Detector Output (No RF Applied) Reference Output (No RF Applied) Reference - Detector Output Differential Voltage (No RF Applied) Detector Output Fin = 1.0 GHz, RFin = -5.0 dBm (50 W) Fin = 1.0 GHz, RFin = 5.0 dBm (50 W) Fin = 1.0 GHz, RFin = 15 dBm (50 W) Enable Logic High Enable Logic Low Enable Input Current, VCC = 2.7 V, Venable = 2.4 V 1 kHz 10 kHz DET_OUT REF REF- DET_OUT - 1 6 1,6 - - - - Vih Vil Iin 3 3 3 2.4 0 0 100 335 1285 - - - - - - - 0.4 30 V V mA Symbol - Icc(op) Icc(stby) RR Pin 4 2 2 2 - - 40 50 5 56 41 45 55 10 - - 50 60 15 mV mV mV mV Min 100 - - Typ - - 1 Max 2000 500 10 Unit MHz mA mA dB
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NCS5000
Vbat Power Amplifier RFin APC Control Input 20 dB Vbat RFout NCP500 2.8 V LDO MCU Port Enable
Coupler
VCC Compensated Current Sources RF_In
Ramp Control (DAC) + - + -
REF DET_OUT
Note: The RF signal must be AC-coupled into the RF_In pin
NCS5000
GND
Figure 2. Typical Application Block Diagram
APPLICATION INFORMATION The NCS5000 is an integrated RF schottky detector designed for use in level detector and power amplifier control circuits. The device is optimized for large signal applications (Pin u -20 dBm) such as those found in GSM handsets and data modems. This device has been designed for applications that require operation from a single Li-Ion or multi- Ni-MH battery pack. The operating range is 2.7-5.5 V so the device can be powered directly from the battery or a low drop out regulator. To support power sequencing, an Enable circuitry is included which allows the device to be placed into a very low power state (t3.0 mW) when not in use. In addition to the RF detector, a reference detector is included so the NCS5000 can be used to implement a differential detector. Since the RF and reference detectors are integrated on the same silicon, they track each other tightly over temperature, bias voltage, and process. Each detector is biased with approximately 45 mA of current and there is a built-in offset of 10 mV (nom) between the RF and the Reference Detector.
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NCS5000
10000 65
VDET - VDET(NO RF) (mV)
1000 VOLTAGE (mV)
60 REF 55
100
GSM (897.5 MHz)
10 1 GHz 1 2 GHz
DCS (1747.5 MHz)
50 DET_OUT 45
0.1 -25 -20 -15 -10 -5
0
5
10
15
20
25
30
40 -40
-15
10
35
60
85
INPUT POWER (dBm)
TEMPERATURE (C)
Figure 3. Detector Output Voltage vs. RF Input Power (VCC = 2.7 V)
Figure 4. Detector and Reference Output Variation Over Temperature (VCC = 2.7 V, No RF Applied)
65
20 DIFFERENTIAL VOLTAGE (mV)
15 VOUT (mV) REF - DET_OUT 10
60
REF
55
50
DET_OUT
5 45
0 -40
-15
10
35
60
85
40 2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
TEMPERATURE (C)
VCC VOLTAGE (V)
Figure 5. Offset Between RF Detector and Reference Detector Output Voltage Over Temperature (VCC = 2.7 V, No RF Applied)
2500 Ienable + ICC CURRENT (A) 500 450 2000 400 350 ICC (A) 1500 300 250 200 150 100 VCC = 2.7 V 0 -30 -25 -20 -15 -10 -5 0 5 10 15 20 50 0 -40
Figure 6. Detector and Reference Output Variation Over VCC Bias (TA = 255C, No RF Applied)
1000 VCC = 5.5 V 500
-15
10
35
60
85
INPUT POWER (dBm)
TEMPERATURE (C)
Figure 7. Current Consumption vs. Input Power TA = 255C, Fin = 100 MHz
Figure 8. ICC Variation Over Temperature VCC = 5.5 V, No RF Applied
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NCS5000 INFORMATION FOR USING THE TSOP-6 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.094 2.4
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 1.0 inches mm
TSOP-6 TSOP-6 POWER DISSIPATION The power dissipation of the TSOP-6 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the TSOP-6 package, PD can be calculated as follows:
PD = TJ(max) - TA RJA
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 400 milliwatts.
PD = 150C - 25C = 417 milliwatts 300C/W
The 300C/W for the TSOP-6 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 417 milliwatts.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling.
*Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
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NCS5000
PACKAGE DIMENSIONS
TSOP-6 SN SUFFIX CASE 318G-02 ISSUE H
A L
6 5 1 2 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
S
B
D G M 0.05 (0.002) H C K J
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NCS5000
Notes
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NCS5000
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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NCS5000/D

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